Samsung Plans Chip Packaging Research Center in Japan

21 Dec, 2023

Samsung Plans Chip Packaging Research Center in Japan

Samsung Electronics, a major player in the global tech industry, is poised to make a substantial investment totaling around 40 billion yen, spread across five years, for the establishment of an advanced chip packaging research facility in Japan. This significant financial commitment was confirmed by the city of Yokohama.

The decision to invest in this facility aligns with Samsung's broader strategy to delve deeper into the realm of chip packaging. Back in March, hints surfaced that Samsung was contemplating setting up this packaging facility in Kanagawa prefecture, where it already houses a research and development center. The aim behind this move is to establish stronger bonds and collaborations with Japanese manufacturers specializing in chip production equipment and materials.

The timing of Samsung's investment is noteworthy, especially amidst the global landscape where there's a growing emphasis on countering China's rapid technological advancements. Advanced chip packaging is pivotal as it involves integrating various components within a single package to enhance overall chip performance.

Kyung Kye-hyun, the head of Samsung's chip business, emphasized the strategic importance of this Japanese facility. This investment not only aims to reinforce Samsung's standing in the fiercely competitive chip industry but also signifies an opportunity to forge collaborations with key companies in Yokohama focusing on chip packaging and related technologies. This move is anticipated to be a significant milestone in Samsung's innovation endeavors within the Japanese market.