Malaysia and China Strengthen Chip Collaboration with Joint Expo Initiative

16 Aug, 2024

Malaysia and China Strengthen Chip Collaboration with Joint Expo Initiative

Malaysia and China are collaborating on a joint semiconductor industry event to enhance chip cooperation. The Asia-Pacific Semiconductor Summit and Expo, set for October in Penang, will gather businesses involved in chip design, manufacturing, and research. This partnership aligns with Malaysia's goal to advance its semiconductor industry and bolster supply chains.

The expo is expected to attract a significant number of Malaysian and Chinese companies, with Malaysia aiming to elevate its “Silicon Valley of the East” status. This joint effort follows an agreement between Malaysian Prime Minister Anwar Ibrahim and Chinese Premier Li Qiang to strengthen bilateral relations.

With tensions between the U.S. and China, Malaysia's strategic neutrality is positioning it as an attractive destination for foreign investment, including major American chip companies like Intel and Texas Instruments.